We do not turn this site into a product database. For the same adhesive, the right grade can vary widely by working conditions. Letting our sales engineer match the grade to your substrate, cure conditions, reliability and volume is more efficient than scanning dozens of grades yourself.
Achieves electrical and thermal conductivity through metal fillers, replacing or complementing soldering — especially for heat-sensitive components, fine-pitch interconnects and flexible substrates that cannot survive reflow.
Efficient heat paths for high-power chips, power modules and battery systems — greases, gels and thermally conductive tapes.
Moisture, dust, salt-fog and flame protection for electronic units while cushioning mechanical stress.
Carrying structural strength and long-term loads for high-strength bonding and sealing of metals, composites and engineering plastics.
Seconds-level curing for active alignment, high-speed automated assembly and heat-sensitive substrates — the workhorse for optical and medical disposables.
Filling, encapsulation and interconnect materials for Fan-Out, 2.5D/3D IC and BGA/CSP — controlling warpage and extending solder joint life.
Adhesive selection is not about SKU count — the same epoxy may need very different grades for -40℃ and 200℃ service; the same conductive silver can behave very differently on die attach vs flexible electrodes. Locking grades into a file gets outdated and misleading fast.
Our approach: the site shows application direction, and our sales engineer matches the specific grade to your conditions from our stocked portfolio — one-to-one, kept current with your project.
Contact Sales Engineer →以下为我们重点推荐的成熟产品型号，可查看完整参数并下载技术资料；如需其他型号，请交由业务经理匹配。
Substrate, service temperature, cure conditions, reliability, volume — your sales engineer replies within 24 hours.
Contact Sales Engineer