Reworkable one-part epoxy underfill designed for CSP, WLCSP and BGA. The low-viscosity formula flows at room temperature without preheating and cures quickly at moderate temperature to minimise stress on other components. High Tg and fracture toughness deliver excellent solder joint protection under thermal cycling.
| Components | One-part |
|---|---|
| Chemistry | Epoxy |
| Appearance | Black liquid |
| Cure | Heat cure |
| Viscosity (1,000 s⁻¹ @25℃) | 350 mPa·s (cP) |
| Specific Gravity | 1.23 |
| Pot Life (25℃, <50% viscosity rise) | 3 days |
| Work Life (25℃) | 1 day |
| Recommended Cure | >10 minutes @ 130℃ |
| Glass Transition (Tg, TMA) | 131 ℃ |
| CTE (below Tg) | 48 ppm/℃ |
| CTE (above Tg) | 175 ppm/℃ |
| Storage Modulus (DMA @25℃) | 3,004 N/mm² (~435,580 psi) |
| Features | Halogen-free · Reworkable · Room-temperature flow |
| Package Types | CSP, WLCSP, BGA |
| Storage | -20℃ frozen, 180 days shelf life |
| Thawing | ~2 h for 30/55 cc syringes; 4–5 h for 6 oz cartridges; do not re-freeze |
TDS, MSDS, RoHS/REACH and samples — our engineers respond within 24 hours.
Contact an Engineer