Conductive silver adhesive for die attach, suited to high-speed dispensing equipment. Solvent-free, highly reliable and thixotropic, with good adhesion to a range of materials and no tailing or stringing.
| Filler Type | Silver |
|---|---|
| Viscosity | 11000 cp (Brookfield CP51 @5rpm, 25℃) |
| Thixotropic Index | 5.5 |
| Working Time | 24 hr (25℃, 25% viscosity rise) |
| Shelf Life | 1 year at -40℃ |
| Recommended Cure | Ramp 3–5℃/min to 175℃ + 1 hr |
| Glass Transition (Tg) | 125 ℃ |
| CTE (below Tg) | 40 ppm/℃ |
| CTE (above Tg) | 140 ppm/℃ |
| Thermal Conductivity | 2.6 W/m·K |
| Volume Resistivity | 1×10⁻⁴ Ω·cm |
| Die Shear Strength | 25 kgf/die @25℃; 1.0 @260℃ |
| Ionic Content | Cl⁻<20 / Na⁺<10 / K⁺<10 ppm |
TDS, MSDS, RoHS/REACH and samples — our engineers respond within 24 hours.
Contact an Engineer