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LOCTITE ABLESTIK 2151 Thermally Conductive Adhesive

Two-Part Epoxy · Thermally Conductive · RT Cure

Thixotropic two-part thermally conductive adhesive that forms strong, durable, high-impact bonds at room temperature, improving heat transfer while maintaining electrical insulation. Passes NASA outgassing standards.

  • Thermally conductive yet electrically insulating
  • Room-temperature cure for heat-sensitive components
  • Passes NASA outgassing standards, chemically resistant

Applications

Transistor stakingDiode & resistor bondingIC thermal mountingHeat-sensitive component bonding

Technical Data

ChemistryTwo-part epoxy
AppearanceBlue
Mix RatioResin : Hardener = 100 : 9.5 by weight
Viscosity (25℃)40,000 mPa·s
Thixotropic Index1.7
Specific Gravity2.3 g/cm³
Pot Life45 min (25 g) / 35 min (100 g)
Cure25℃×24hr or 65℃×2–4hr
Service Temperature-70 to 115 ℃
CharacteristicsThermally conductive, electrically insulating, high adhesion
CertificationPasses NASA outgassing standards

Documents

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