One-part heat-cure epoxy underfill. General-purpose, black, good flow and easy rework — mainly for BGA/CSP protection and FPC reinforcement in portable phones and notebooks.
| Components | One-part |
|---|---|
| Appearance | Black liquid |
| Chemistry | Epoxy |
| Density | 1.25 g/cm³ |
| Viscosity | 600 mPa·s |
| Recommended Cure | 130℃ × 10 min |
| Service Temperature | -40 to 150 ℃ |
| Storage Modulus | 4000 MPa |
| Glass Transition (Tg) | 117 ℃ |
| CTE (below Tg) | 45 ppm/℃ |
| CTE (above Tg) | 160 ppm/℃ |
| Packaging | 50 mL syringe · Code 6631H1 |
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