One-part adhesive designed for protecting optoelectronic structural components. Fast cure at low temperature, low moisture uptake and high Tg — suited to heat-sensitive precision optoelectronics.
| Components | One-part |
|---|---|
| Appearance | Black paste |
| Density | 1 g/cm³ |
| Viscosity | 2W+ CP |
| Thixotropic Index | >2 |
| Working Time | >24 hours |
| Shelf Life | 1 year at -40℃ |
| Recommended Cure | 30 minutes @100℃ |
| Water Absorption | 0.74% (boiling water, 2 hours) |
| Glass Transition (Tg) | 100 ℃ |
| CTE (below Tg) | 29 ppm/℃ |
| CTE (above Tg) | 101 ppm/℃ |
| Die Shear Strength | 10 kgf/die @25℃ |
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