Huitian 9508G One-Part Thermal Gel
8.5 W/m·K · One-Part · Low Bleed
- 8.5 W/m·K thermal conductivity for high-power chips
- Highly thixotropic, fills varying gap thickness at low pressure
- Low volatility and low bleed after cure
Starting from optical communications, Dongli has extended its adhesive application expertise across AI computing, humanoid robotics, advanced packaging, automotive electronics, semiconductor, BCI, energy storage and eVTOL — we deliver production-validated process solutions, not just material lists.
Each item below is an application direction we have actually delivered — no empty adjectives.
Real delivered projects — customer names withheld under confidentiality.
Complete material package for FAU alignment, laser coupling and hermetic sealing at leading optical module makers.
Low-viscosity penetrating potting plus thermal solutions for the tight space and heat load of coreless motors.
Flame-retardant potting and conformal protection for ECUs; low-stress thermal interface materials for battery modules.
以下为我们重点推荐的成熟产品，可直接下载技术资料；具体型号匹配请联系应用工程师
Strong matrix of domestic and global brands, factory-direct with traceability.
Mainstream grades in stock, custom small-lot repacking, same-day dispatch.
Field-experienced engineers for grade comparison, process window tuning and failure analysis.
TDS, MSDS, RoHS/REACH, ISO 10993 and USP Class VI documentation.
Founded in 2019 in Dongguan, Dongli started in optical communications and has extended its adhesive application expertise across AI computing, humanoid robotics, advanced packaging, automotive electronics, semiconductor, BCI, energy storage, eVTOL and medical.
We do more than distribute materials — we work alongside customers' process engineers to integrate grade selection, dispensing, cure profile and reliability validation into one production-ready line solution.
Share substrate, service temperature, cure constraints and volume — get a proposal within 24 hours.
Contact an Engineer