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Structural Adhesives

Huitian 6066 One-Part High-Temp Epoxy

High Thixotropy · Tg 174℃ · Magnet & Core Bonding

Grey high-thixotropy one-part heat-cure epoxy with high bond strength and high-temperature resistance. Controllable bond line of 0.7±0.1 mm, RoHS and REACH compliant, designed for magnet and magnetic core bonding.

  • Tg of 174℃ (TMA) with strength retained at high temperature
  • 17.5 MPa shear strength even at 180℃
  • High thixotropy holds bond line at 0.7±0.1 mm
  • RoHS and REACH compliant

Applications

Magnetic core bondingMagnet bondingControlled-bond-line high-strength bondingMotor & electroacoustic components

Technical Data

ComponentsOne-part
AppearanceBlack paste
ChemistryEpoxy
Viscosity (52# 0.5r)390 Pa·s
Density1.28 g/cm³
Bond Line0.7 ± 0.1 mm
Cure (120℃)40 min
Cure (150℃)15 min
Cure (180℃)10 min
HardnessShore D 88
Glass Transition (Tg, TMA)174 ℃
CTE α151 μm/(m·℃)
CTE α2175 μm/(m·℃)
Shear Strength (AnAL)21 MPa
Shear Strength @180℃ (AnAL)17.5 MPa
Service Temperature-40 to 180 ℃
ComplianceRoHS, REACH
PackagingCode 606614 · 310 mL cartridge, 30/carton
Storage0–5℃ sealed and dry, 6 months shelf life

Documents

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