PUR structural adhesive engineered for ultra-thin phones with ultra-narrow bezels. Excellent impact resistance and long service life in harsh environments, achieving reliable bonding on 0.5 mm bezels.
| Appearance | Black |
|---|---|
| Viscosity (110℃) | 4200 mPa·s |
| Initial Strength | 2.7 (2h) |
| Modulus | 64 MPa |
| Elongation at Break | 750% |
| Open Time | 4 min |
| Shear Strength (24h) | PC+20%GF//ink glass 7.69 MPa |
| Damp Heat | 55℃ / 95%RH × 500h |
| High-Temp Aging | 85℃ × 500h |
| Thermal Shock | -40 to 70℃ × 500 cycles |
TDS, MSDS, RoHS/REACH and samples — our engineers respond within 24 hours.
Contact an Engineer