A classic two-part conductive silver epoxy from EPO-TEK, filled with silver flakes for both electrical and thermal conduction — long established as a standard die-attach material in semiconductor and optoelectronic packaging.
| Chemistry | Two-part epoxy |
|---|---|
| Filler | Silver |
| Mix Ratio | 1:1 by weight |
| Appearance | Silver-grey paste |
| Cure | 150℃×1hr / 200℃×30min |
| Service Temperature | Wide range, suited to semiconductor packaging |
| Typical Use | Die attach, optoelectronic interconnect |
| Note | Refer to the latest factory TDS for exact values |
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