Two-part addition-cure thermal potting silicone in grey flowable form with 1:1 mix ratio, curing at room temperature or with heat. Bonds glass and PCB without primer, offering excellent insulation, weathering and aging resistance from -40℃ to 200℃.
| Components | Two-part (A:B = 1:1) |
|---|---|
| Cure Type | Addition cure |
| Appearance (A) | White fluid |
| Appearance (B) | Grey fluid |
| Viscosity (A) | 6000–14000 mPa·s |
| Viscosity (B) | 6000–16000 mPa·s |
| Viscosity (A+B) | 6000–15000 mPa·s |
| Flow Value | ≥ 5.0 cm |
| Working Time (25℃) | 60–360 min |
| Cure (80℃) | ≤ 30 min |
| Density | 2.8–3.0 g/cm³ |
| Hardness | Shore A 15–40 |
| Thermal Conductivity | 2.0–2.5 W/m·K |
| Dielectric Strength | ≥ 14 kV/mm |
| Volume Resistivity | ≥ 1×10¹² Ω·cm |
| Flammability | UL94 V-0 |
| Service Temperature | -40℃ to 200℃ |
| Packaging | 5291A4 / 5291B4 · 10 kg pail each |
| Storage | 8–28℃ dry, 4 months shelf life |
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