Conductive adhesive designed for high-power LED and IC die attach, combining high thermal and electrical conductivity. Excellent rheology prevents tailing and stringing during dispensing — suited to high-speed lines.
| Filler Type | Silver |
|---|---|
| Viscosity | 1W+ cP (Brookfield CP51 @5rpm, 25℃) |
| Thixotropic Index | >5.0 |
| Working Time | >24 hours (25℃, 25% viscosity rise) |
| Shelf Life | 1 year at -40℃ |
| Recommended Cure | Ramp 3–5℃/min to 150℃ + 120 min |
| Alternative Cure | Ramp 3–5℃/min to 175℃ + 60 min |
| Glass Transition (Tg) | 120 ℃ |
| CTE (below Tg) | 38 ppm/℃ |
| CTE (above Tg) | 125 ppm/℃ |
| Thermal Conductivity | >20 W/m·K |
| Volume Resistivity | <10⁻⁵ Ω·cm |
| Die Shear | 15 kgf/die @25℃; 2.3 @200℃; 1.1 @260℃ |
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