Black one-part heat-cure epoxy backfill with strong plastic adhesion, low outgassing, low moisture uptake, high Tg and non-conductive. Designed for optoelectronic potting and structural bonding; used with AA50T for post-alignment backfill.
| Chemistry | One-part epoxy |
|---|---|
| Appearance | Black |
| Viscosity (25℃, 5rpm) | 23,500 mPa·s |
| Thixotropic Index | 1.9 |
| pH | 4.2 |
| Work Life | 24 hours @25℃ |
| Cure | 100℃ × 30 min |
| Glass Transition (Tg) | 94 ℃ (TMA) |
| CTE (below Tg) | 32 ppm/℃ |
| CTE (above Tg) | 87 ppm/℃ |
| Storage | -40℃, 12 months |
| Packaging | 16 g syringe |
TDS, MSDS, RoHS/REACH and samples — our engineers respond within 24 hours.
Contact an Engineer