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Thermal Interface Materials

Huitian 9508G One-Part Thermal Gel

8.5 W/m·K · One-Part · Low Bleed

Ceramic/silicone thermal composite in grey-white paste form, one-part post-cure gel. Highly thixotropic and moldable, filling gaps of varying thickness under low pressure — ideal for automated dispensing lines.

  • 8.5 W/m·K thermal conductivity for high-power chips
  • Highly thixotropic, fills varying gap thickness at low pressure
  • Low volatility and low bleed after cure

Applications

Optical communicationsAutomotive electronicsMobile devicesTelecom base stationsGraphics cardsMicroprocessors & chips

Technical Data

ComponentsOne-part
ColorGrey-white
Thermal Conductivity8.5 W/m·K (ASTM D5470)
Density3.16 g/cm³ (ASTM D792)
Extrusion Rate130–150 g/min
Min. Bond Line0.2 mm
Volume Resistivity≥ 1.0×10¹³ Ω·cm (ASTM D257)
Dielectric Strength≥ 8.0 kV/mm (ASTM D149)
FlammabilityUL94 V0
Service Temperature-40 to 150 ℃
Cure80℃×60min or 150℃×30min
Packaging9508G1 · 30 mL syringe

Documents

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