TORYDA · Proven Adhesive Solutions for 12 High-Tech Industries
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Twelve Industries · Proven Adhesive Solutions

Every industry carries its own process challenges — temperature, stress, precision, certification and production consistency. Below are the applications we have actually delivered. Specific adhesive solutions are matched to your substrate, cure conditions and volume by our application engineers.

AI Computing
01

AI Computing

Rising GPU and ASIC power makes thermal management the bottleneck. Interface materials must combine high conductivity with long-term stability — no drying, pump-out or migration; optical module coupling also requires precision at production speed.

  • Thermal Interface MaterialBuild an efficient heat path to control junction temperature.
  • Vapor Chamber & Heat Sink BondingCombines structural fixing with heat conduction.
  • Optical Module CouplingOptical path coupling and structural fixing inside 800G/1.6T modules.
  • Cold Plate SealingLong-term immersion resistance to coolant.
Material Matching: Our application engineer will match the best material to your substrate, cure conditions and volume.Contact Engineer →
Humanoid Robotics
02

Humanoid Robotics

Tight space inside dexterous hands, concentrated motor heat and repeated motion fatigue — materials must penetrate when liquid yet deliver thermal conduction and reinforcement once cured.

  • Micro Motor PottingLow-viscosity penetration with both heat dissipation and reinforcement.
  • Encoder & Torque Sensor BondingMaintains assembly precision, resists creep.
  • Reducer & Joint SealingOil and wear resistance to prevent leakage.
  • Harness Strain ReliefBending fatigue resistance to keep harnesses secured.
Material Matching: Our application engineer will match the best material to your substrate, cure conditions and volume.Contact Engineer →
Advanced Packaging
03

Advanced Packaging

2.5D/3D stacking brings warpage control, fine-pitch filling and multiple reflow survival — materials must balance low CTE, high Tg and sufficient flow.

  • Fan-Out Wafer Level PackagingLarge-area molding with warpage control.
  • 2.5D / 3D IC StackingInter-layer bonding and filling.
  • TSV FillingVoid-free filling of high aspect ratio vias.
  • BGA / CSP UnderfillCapillary flow into micro gaps.
Material Matching: Our application engineer will match the best material to your substrate, cure conditions and volume.Contact Engineer →
Optical Communications
04

Optical Communications

Sub-micron coupling accuracy demands low shrinkage, high transmission and low outgassing, validated by 85℃/85%RH aging — the field where Dongli started and knows best.

  • FAU V-Groove FixingLow-shrinkage precision positioning.
  • Laser Diode CouplingCompatible with active alignment.
  • Hermetic Optoelectronic SealingLow outgassing and high hermeticity.
  • PLC Splitter BondingConsistent multi-channel bonding.
Material Matching: Our application engineer will match the best material to your substrate, cure conditions and volume.Contact Engineer →
EV Electronics
05

EV Electronics

Automotive grade means 15+ years under combined thermal cycling, random vibration, humidity and chemical exposure — failure is a recall-level risk.

  • ECU Conformal PottingMoisture, salt fog and fungus protection.
  • BMS Thermal & InsulationThermal path plus high-voltage insulation.
  • LiDAR SealingOptical window sealing and housing waterproofing.
  • Lamp & Sensor BondingUV and thermal shock resistance.
Material Matching: Our application engineer will match the best material to your substrate, cure conditions and volume.Contact Engineer →
Semiconductor
06

Semiconductor

Shrinking die size and rising power density demand thermal stability, low stress and ultra-low ionic residue within a narrow process window.

  • Die AttachConductive or insulating die attach with low stress.
  • UnderfillCapillary filling of BGA/CSP gaps.
  • Wafer Dicing ProtectionTemporary protective coating preventing chipping.
  • Dam & Edge FillFlow control to protect wire bonds.
Material Matching: Our application engineer will match the best material to your substrate, cure conditions and volume.Contact Engineer →
Brain-Computer Interface
07

Brain-Computer Interface

Implant-grade applications demand biocompatibility and long-term stability in body fluids, plus miniaturization and flexible substrate compatibility.

  • Micro-electrode EncapsulationHigh dielectric strength and precise thin-layer coating.
  • Flexible Electrode BondingLow modulus, bend-resistant.
  • Implant-grade Biocompatible SealingISO 10993 / USP Class VI compliant.
  • Lead Sealing & Stress ReliefBlocks fluid ingress and relieves stress.
Material Matching: Our application engineer will match the best material to your substrate, cure conditions and volume.Contact Engineer →
Energy Storage
08

Energy Storage

Storage systems face long-term high-current cycling, outdoor temperature swings and vibration. Battery modules need stable heat dissipation, fire/explosion protection, and structural bonding that survives repeated cell expansion and contraction.

  • Battery Module TIMHigh-efficiency heat dissipation balancing inter-module temperature.
  • Cell Bonding & FixingSurvives repeated cell expansion stress.
  • PCS Power Module PottingHigh thermal conductivity with insulation.
  • Storage System Conformal CoatingMoisture, salt fog and fungus protection.
Material Matching: Our application engineer will match the best material to your substrate, cure conditions and volume.Contact Engineer →
eVTOL & Low-Altitude
09

eVTOL & Low-Altitude

Low-altitude aircraft demand extreme lightweighting and reliability. Composite structural bonding must combine strength, toughness and fatigue resistance; power motors and electronics must survive aviation-grade vibration and temperature environments.

  • Composite Structural BondingReplaces some riveting and bolting, reducing weight.
  • Power Motor PottingAviation-grade vibration and temperature resistance.
  • Airframe Sealing & ConformalRain, moisture and salt-fog protection.
  • Flight Control & Sensor BondingImpact and vibration resistance.
Material Matching: Our application engineer will match the best material to your substrate, cure conditions and volume.Contact Engineer →
Medical Devices
010

Medical Devices

Medical manufacturing comes down to three things: biocompatibility certification, sterilization resistance and batch consistency — backed by full documentation and traceability.

  • Catheter & Tubing BondingReliable bonding across medical plastics.
  • Endoscope Lens EncapsulationPrecision optical alignment surviving sterilization.
  • Disposable Device AssemblySeconds-level curing for high-speed automated assembly.
  • Wearable Device BondingLow sensitization, sweat and wear resistance.
Material Matching: Our application engineer will match the best material to your substrate, cure conditions and volume.Contact Engineer →
Smart Wearables
011

Smart Wearables

Wearables keep shrinking while packing in more functions, squeezing the space available for materials — all while meeting IP68 waterproofing, sweat resistance and long-term skin-contact safety.

  • Waterproof SealingReliable sealing of housing and button gaps to support IP68 ratings.
  • Micro-Component FixingPrecision positioning of speakers, microphones and sensors.
  • Housing Structural BondingHigh-strength bonding between metals, ceramics and engineering plastics.
  • Skin-Contact BondingLow sensitization and sweat resistance for long-term wear.
Material Matching: Our application engineer will match the best material to your substrate, cure conditions and volume.Contact Engineer →
AR / VR Glasses
012

AR / VR Glasses

Optical assembly accuracy directly determines image quality — lens bonding needs ultra-low shrinkage and high transmission. All this inside an extremely light body that still must dissipate heat and stay rigid; every gram saved is competitive advantage.

  • Optical Lens Bonding & AlignmentLow shrinkage and high transmission for long-term optical axis stability.
  • Display Module EncapsulationEncapsulation and protection of Micro-OLED / Micro-LED units.
  • Lightweight Structural BondingComposite and magnesium-aluminium bonding replacing some fasteners.
  • Thermal ManagementHeat paths in confined space to control surface temperature.
Material Matching: Our application engineer will match the best material to your substrate, cure conditions and volume.Contact Engineer →

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