One-part heat-cure silver-filled epoxy conductive adhesive designed for microelectronic die attach. Low bleed and low outgassing, delivering all-round superior performance to traditional soldering.
| Chemistry | One-part epoxy |
|---|---|
| Filler | Silver |
| Appearance | Silver paste |
| Viscosity (25℃) | 30000 mPa·s |
| Thixotropic Index | 4.0 |
| Volume Resistivity | 0.0005 Ω·cm |
| Die Shear Strength | 19 kg-f (2×2 mm Si on Ag/Cu LF @25℃) |
| Lap Shear (Al to Al) | 12 N/mm² (1500 psi) |
| Cure | 150℃ × 1 hr |
| Glass Transition (Tg) | 103 ℃ (TMA) |
| Thermal Conductivity | 2.4 W/m·K |
| Ionic Content | Cl⁻≤20 / Na⁺≤20 / K⁺≤10 ppm |
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