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Camera Module Adhesive Solutions · SKBOND, Korea

SHIN KWANG CHEMICALS (SKBOND, Korea) has specialized in camera-module adhesives for decades, covering lens attach, flange attach, barrel assembly, IR filter bonding, die attach and housing bonding through four cure systems: UV, moisture, UV+heat and two-component. TORYDA is the authorized channel in China, providing selection support and local supply.

① Lens Attach ② Flange Attach ③ Barrel Assembly ④ IR Filter Bonding ⑤ Die Attach ⑥ Housing Bonding Quick Selection Table

Overview

4 cure systems · 6 bonding processes

UV cureUV + heat dual cureMoisture cureTwo-componentHeat-cure epoxy

Six bonding processes across the whole module assembly

SKBOND provides six adhesive families following the camera-module assembly sequence — from precision lens-to-barrel bonding to sensor die attach on PCB — each with cure systems and property grades matched to dispensing line speeds.

Lens attach: lens to barrel (UV / UV+heat)
Flange attach: VCM to flange (UV)
Barrel assembly: barrel to retainer (heat / dual cure)
IR filter bonding: filter to holder (heat cure)
Die attach: image sensor positioning (heat cure)
Housing bonding: lensed housing to PCB (heat / UV+heat)

Lens Attach

UV or UV+heat cure

UV-curable adhesives for bonding the lens to the barrel — a critical process for image quality and line tact time.

Excellent adhesion & removal forceimproves rework reliability

No Flarelow reflectance and transmittance reduce flare caused by light reflection

Deep cureexcellent depth curing speeds up work and improves yield

High thixotropyreduces gate (hole) clogging

Grade	Cure condition	Viscosity [cP]	Thixotropic index	Hardness [D type]
UC-1003B series	2,000 mJ/cm²	2,000 – 20,000	2.0 – 6.0	30 – 80
TB-1QUS-RE(V4)	2,000 mJ/cm² + 80℃ × 30min	10,000 – 15,000	2.0 – 4.0	50 – 70

Flange Attach

UV cure

UV-curable adhesives for bonding the VCM to the flange.

Good adhesionexcellent removal force improves reliability

Vision inspectionfluorescent-doped grades enable vision checks and improve yield

High thixotropystable dispensing across a wide range of VCM and flange sizes

Deep cureexcellent deep-section curing raises throughput and yield

Grade	Cure condition	Viscosity [cP]	Thixotropic index	Hardness [D type]
UC-133B series	2,000 mJ/cm²	2,000 – 8,000	1.5 – 2.5	50 – 60
UC-1355 series	2,000 mJ/cm²	3,000 – 8,000	2.0 – 5.0	40 – 80

Barrel Assembly

Heat cure / UV+heat dual cure

Heat-curing adhesives used in the dispensing and curing process for permanent assembly of the barrel and retainer.

Optimized viscosity & thixotropymatched to assembly process

Proper penetrationfills fitting gaps for a secure lock

45 kgf+ bond strengthexcellent adhesion after cure

Dual-cure low shrinkage≤ 0.22% change from UV pre-cure to final heat cure

Grade	Chemistry / system	Color	Cure condition	UV dose
SAC-9663	Epoxy · heat only	Black	80℃ × 20min	—
TB-1QUS-LB	Epoxy + acrylate · UV+heat	Dark gray	80℃ × 30min	2,000 mJ/cm²

IR Filter Bonding

Heat cure / UV cure

Heat-curing adhesives for bonding the IR filter — which blocks infrared while transmitting visible light — to its holder.

Four-point process fitproper viscosity and thixotropy

Low-viscosity spreadexcellent dot-spreading behavior

Broad adhesionstrong on both film and glass filters

Low RBOreduces rework damage risk

Grade	Chemistry / system	Color	Cure condition	Typical use
SAC-9640	Epoxy · heat only	Black	80℃ × 30min	Low-resolution 5M products
SAC-9640-15	Epoxy · heat only	Black	80℃ × 20min	High-resolution 48M / 68M products
UC-199F	PU · acrylate (UV)	Pale yellow	2,000 mJ/cm²	UV fast-cure lines

Die Attach

Heat cure

Heat-curing adhesives that position and fix the image sensor onto the PCB by pattern recognition.

Excellent tilt controlproper viscosity/thixotropy keeps placement accurate

Dispensing friendlygreat processability for dispensing lines

Low warpagereduces placement shift and stress deformation

Outstanding metal adhesionhardness-matched grades; rapid cure at 80℃ / 120℃

Grade	Chemistry / system	Color	Cure condition	Typical use
SDA-9000	Epoxy · heat only	Black / milky white	80℃ × 2min	Low hardness, low modulus, rapid cure
SDA-9505	Epoxy · heat only	Black / red	120℃ × 2min	Very high adhesion required

Housing Bonding

Heat cure / UV+heat cure

Heat-curing or UV+heat adhesives for bonding the lensed housing module to the edge of the sensor board.

Excellent dispensingmultiple viscosity/thixotropy grades to match line speed

Strong on LCP / PA (PPA)reliable bonding to low-polarity engineering plastics

Low reliability driftminimal bond-strength loss after drop and reliability tests

Low-temperature rapid cureshortens tact time

Grade	Chemistry / system	Color	Cure condition	Highlights
SAC-9626	Epoxy · heat only	Black	80℃ × 30min (dry oven)	Low hardness / modulus, impact resistant
SAC-9836	Epoxy · heat only	Black	80℃ × 30min (dry oven)	Low hardness / modulus, impact resistant
SAC-9826	Epoxy · heat only	Black	80℃ × 30min (dry oven)	General housing bonding
TB-1QUS-C11	UV+heat system	Dark gray	90℃ × 3min (hot-plate) + UV 2,000 mJ/cm²	Dual cure, excellent bond strength

Beyond camera modules, the same SKBOND platform also covers display-panel module, PCB module, and micro-speaker & earphone component adhesives — ask TORYDA application engineers for the corresponding selection guides.

Quick Selection Table

15 grades mapped by process

Process	Cure system	Recommended grades	Typical cure condition
① Lens attach	UV / UV+heat	UC-1003B series, TB-1QUS-RE(V4)	2,000 mJ/cm² (± 80℃ × 30min)
② Flange attach	UV	UC-133B series, UC-1355 series	2,000 mJ/cm²
③ Barrel assembly	Heat / UV+heat	SAC-9663, TB-1QUS-LB	80℃ × 20–30min (+ UV 2,000 mJ/cm²)
④ IR filter bonding	Heat / UV	SAC-9640, SAC-9640-15, UC-199F	80℃ × 20–30min / 2,000 mJ/cm²
⑤ Die attach	Heat	SDA-9000, SDA-9505	80℃ × 2min / 120℃ × 2min
⑥ Housing bonding	Heat / UV+heat	SAC-9626, SAC-9836, SAC-9826, TB-1QUS-C11	80℃ × 30min / 90℃ × 3min + UV

Need SKBOND Selection Support, TDS or Samples?

Tell us the module structure, substrates and cure conditions — our engineers will confirm grades, dispensing parameters and supply

Contact Application Engineers